10114829-10202LF
Description
1.25mm Wire to Board Wafer, Vertical, Through Hole, 2 Positions

Quantity
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Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
Fusion-Tested. Quality Guaranteed.
- Compact 1.25mm Pitch Design
- Vertical Orientation for Space Efficiency
- Through Hole Mounting for Enhanced Stability
- 2 Positions for Versatile Connectivity Options
The Amphenol 1.25mm Wire to Board Wafer is a reliable and efficient solution designed for seamless connectivity in various electronic applications. This vertical, through-hole connector features two positions, making it ideal for compact designs where space is at a premium. Engineered for durability and performance, this component ensures secure connections and optimal signal integrity, making it a preferred choice for both industrial and consumer electronics.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
AS6081
AS9120B
ISO 9001
QMS STD 9090
Quantity
Need this part?
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
Fusion-Tested. Quality Guaranteed.
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