5-1542001-3
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
- Material: Cold-Forged Aluminum
- Compact Dimensions: 27.1526mm x 19.05mm x 19.05mm
- Power Dissipation: 5W
- Clip Mounting for Easy Installation
- Black Anodized Finish for Enhanced Durability
- RoHS and ELV Compliant
The TE Connectivity Heat Sink Passive BGA Pin Array Clip is a high-performance thermal management solution designed to efficiently dissipate heat from BGA packages. Constructed from cold-forged aluminum and finished with a sleek black anodized coating, this heat sink is engineered for optimal power dissipation of up to 5W. With its compact dimensions of 27.1526mm in length and 19.05mm in both width and height, it is perfect for applications requiring reliable thermal performance in a space-constrained environment. This product is compliant with RoHS and ELV directives, ensuring it meets modern environmental standards.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.