PM8054B-F3EI

Description
Afm-700 Supercap Kit, 1073 Fbga 27X27X2.23Mm Tray Rohs Compliant: Yes
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  • Compact FBGA Package: 27 mm x 27 mm x 2.23 mm
  • High Pin Count: 1073 Pins
  • RoHS Compliant for Environmental Safety
  • Designed for High-Performance Energy Storage

The Microchip Afm-700 Supercap Kit is a cutting-edge ROM component designed for high-performance applications requiring efficient energy storage solutions. With its compact FBGA package measuring 27 mm x 27 mm x 2.23 mm, this supercapacitor kit is ideal for space-constrained designs. It features a robust pin count of 1073, ensuring versatile connectivity options for various electronic systems. The Afm-700 is RoHS compliant, making it an environmentally friendly choice for modern electronic applications.

The Afm-700 Supercap Kit is designed for use in applications requiring high energy storage and quick discharge capabilities, making it suitable for energy harvesting, backup power, and power stabilization. Its compact FBGA package allows for efficient space utilization in various electronic devices. This product is commonly used by engineers and developers in the fields of consumer electronics, automotive systems, and industrial applications.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090

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