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- 90 Positions with 1.9mm Pitch
- Vertical Orientation for Space Efficiency
- High Data Rate of 25Gbps
- Current Rating of 750mA
- Max Operating Temperature of 85°C
The Molex Conn Backplane RCP is a versatile and reliable connector solution designed for high-density applications. With a pitch of 1.9mm and 90 positions arranged in 9 rows, this press-fit receptacle connector ensures secure and efficient connections in various electronic systems. Its vertical orientation and robust thermoplastic housing make it suitable for demanding environments, while the gold contact plating enhances conductivity and durability. This connector is ideal for applications requiring high data rates and reliable performance.
The Conn Backplane RCP 90POS 1.9mm Press Fit ST Thru-Hole Tray is designed for high-density connections in electronic devices, offering a reliable solution for data transfer and power distribution. Commonly used in telecommunications, data centers, and industrial applications, this connector supports data rates up to 25Gbps and is suitable for environments with temperatures ranging from -55°C to 85°C. It is favored by engineers and designers for its durability and efficient space utilization.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.