76150-1010
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- High Density with 180 Pins
- 1.9mm Pitch for Compact Design
- Right Angle Orientation for Space Efficiency
- Gold Contact Plating for Enhanced Conductivity
- Operating Temperature Range: -55°C to 85°C
The Molex Conn Hard Metric RCP 180 POS 1.9mm Solder RA Thru-Hole Impact™ Tray is a robust and reliable connector solution designed for high-density applications. With a pitch of 1.9mm and a total of 180 pins, this connector is ideal for various electronic devices requiring efficient space utilization and secure connections. The right-angle orientation and solder termination ensure easy installation and a strong mechanical bond, making it suitable for demanding environments.
The Conn Hard Metric RCP 180 POS connector is designed for high-density applications requiring reliable connections in electronic devices. Commonly used in telecommunications, data centers, and industrial equipment, it supports data rates up to 25Gbps and operates efficiently in challenging conditions with a temperature range of -55°C to 85°C. Engineers and designers utilize this connector for its robust solder termination and right-angle orientation, ensuring optimal space utilization and performance.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.