PM5451A-FEI
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- Compact 40x40x3.22mm BGA Package
- Lead-Free & RoHS Compliant
- High Performance for Diverse Applications
- Designed for Reliability and Efficiency
The Microchip Axs 1517 Bbga is a versatile and reliable electronic component designed for a variety of applications. With its compact dimensions of 40x40x3.22mm, this Ball Grid Array (BGA) package ensures efficient space utilization while delivering high performance. Compliant with RoHS standards, it meets environmental regulations without compromising on quality. This component is ideal for use in advanced electronic systems requiring precision and reliability.
The Hyphy Axs 1517 Bbga Tray is designed for the safe and efficient handling and transport of microchips in a controlled environment. It is commonly used in semiconductor manufacturing and assembly processes to organize and protect BGA packages. Engineers and technicians in the electronics industry utilize this tray to ensure that components are handled with care, maintaining their integrity throughout production.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.