XCF04SVOG20C
- Compact TSSOP Package
- Memory Size of 512kB
- Operating Supply Voltage of 3.3V
- Wide Temperature Range from -40°C to 85°C
- Supports Parallel and Serial Interfaces
The Xilinx XCF*S is a versatile FPGA configuration memory device designed for high-performance applications. With a compact TSSOP package, this component offers a memory size of 512kB and operates at a supply voltage of 3.3V. It is suitable for surface mount applications and supports both parallel and serial interfaces, making it an ideal choice for various electronic designs. The device is engineered to function reliably in a wide temperature range from -40°C to 85°C, ensuring optimal performance in demanding environments.
The XCF*S Matte Tin (Sn) EAR99 Tube ics fpga configuration is a specialized configuration memory device designed for Field Programmable Gate Array (FPGA) applications. This 4Mb flash PROM offers parallel and serial interfaces with operational voltages of 3.3V, suitable for various electronic configurations. With its compact TSSOP package and lead-free features, it is ideal for surface mount technology, making it a reliable choice for embedded systems requiring high-speed data access and reliable memory configurations. The device supports a wide operating temperature range, ensuring performance stability in diverse environments.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.