XC7Z020-1CLG400C

Description
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~85C TJ 256KB 667MHz 1V
Number of I/Os
130
Max Frequency
667MHz
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  • High Performance Frequency: 667MHz
  • Compact CSBGA Package with 400 Pins
  • Wide Operating Temperature Range: 0°C to 85°C
  • Multiple Interface Support including CAN and Ethernet
  • Low Operating Supply Voltage: 1V
  • Lead-Free & RoHS Compliant

The Xilinx BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC is a powerful and versatile solution designed for a wide range of applications requiring high performance and efficiency. With a maximum frequency of 667MHz and a compact CSBGA package, this SOC is ideal for embedded systems that demand reliable operation within a temperature range of 0°C to 85°C. Featuring 256KB of memory and 130 I/Os, it supports multiple interfaces, making it suitable for complex designs in various industries.

The BALL BOTTOM MCU FPGA Active System On Chip is used for developing sophisticated embedded applications that require high-performance processing and flexibility. With its ability to interface through multiple protocols like CAN, Ethernet, and USB, it is favored in automotive, industrial, and consumer electronics. Engineers and developers leverage this SOC for its configurable architecture, allowing for tailored solutions in various projects.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090

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