WL1835MODGBMOCR
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- Dual Wireless Functionality for WLAN and Bluetooth
- High Data Rate of 54Mbps for Fast Connectivity
- Operating Frequency of 2.4GHz for Wide Compatibility
- Low Power Consumption with 85mA Receiving and 420mA Transmitting
- Compact 100-Pin SIP SMD Module for Easy Integration
The Texas Instruments WLAN+BTCombo Module Chip is a versatile and high-performance solution designed for seamless wireless connectivity. Supporting IEEE 802.11b/g/n and Bluetooth v4.0 (BLE) with EDR, this 100-pin SIP SMD module is perfect for applications requiring reliable data transmission and low power consumption. With a compact design and robust features, it is ideal for a variety of consumer and industrial devices.
The WLAN+BTCombo Module Chip is designed for integrating Wi-Fi and Bluetooth connectivity into various electronic devices. It supports IEEE 802.11b/g/n standards and Bluetooth v4.0, making it suitable for applications in IoT, home automation, and wearables. Common users include device manufacturers looking for compact, efficient modules to enhance wireless communication capabilities.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.