MCIMX6QP6AVT1AB
- Description
- SOC i.MX 6Quad ARM Cortex A9 40nm Automotive AEC-Q100 624-Pin FBGA Tray
- Datasheet
Quantity
159,960 AvailableLet us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
- i.MX 6 Series Applications processor, the i.MX 6Quad Plus Quad-Core Arm Cortex-A9 Variant
- Flip-Chip Ball Grid Array (FCBGA) Package with 624 Balls
- Supplied in Tray Packaging Rather Than Tape and Reel
- RoHS Compliant
- Classified Under Schedule B Export Code 8542310000
The NXP Semiconductors MCIMX6QP6AVT1AB is a microprocessor from the i.MX 6 series, the i.MX 6Quad Plus applications processor built around four Arm Cortex-A9 cores. It is supplied in a flip-chip ball grid array package carrying 624 balls, and ships in tray packaging. The MCIMX6QP6AVT1AB is RoHS compliant.
An applications processor is a system-on-chip that runs a full operating system such as Linux or Android, combining CPU cores with graphics, display, camera, and connectivity interfaces on a single die. The i.MX 6 family is used across industrial human-machine interfaces, in-vehicle infotainment and instrument clusters, medical displays, point-of-sale terminals, and networking gateways, where long-term product availability matters as much as peak performance. The 624-ball FCBGA package targets multi-layer boards with controlled-impedance memory routing. Typical buyers are industrial and automotive OEMs and module vendors building single-board computers and compute-on-module products.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Quantity
159,960 AvailableLet us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.