THGBMHG6C1LBAIL

- High Capacity Memory: 68719476736 bits
- Fast Operating Frequency: 52MHz
- Robust Interface: MMC
- Durable Contact Plating: Copper Silver Tin
- Wide Operating Temperature Range: -25°C to 85°C
- Surface Mount Design for Easy Integration
The Kioxia Active Copper Silver Tin BALL 2016 is a cutting-edge memory module designed for high-performance applications. With a memory capacity of 68719476736 bits and a frequency of 52MHz, this module is optimized for speed and efficiency. It operates at a supply voltage of 3.3V and is suitable for a wide range of environments, making it an ideal choice for advanced electronic systems.
The Active Copper Silver Tin BALL 2016 is utilized for high-performance flash memory applications, primarily in consumer electronics and embedded systems. It features a 3.3V operating voltage and operates at 52MHz, making it suitable for applications requiring reliable data storage and retrieval. Common users include manufacturers of smartphones, tablets, and other portable devices that require compact and efficient memory solutions.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.