EBTM-4-08-2.0-S-VT-1

Description
ExaMAX® 2.00 mm High-Speed Backplane Vertical Header
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  • High-Speed Data Transmission Capability
  • Compact 2.00 mm Pitch Design
  • Vertical Mount Configuration for Space Efficiency
  • Robust Signal Integrity for Reliable Performance

The Samtec ExaMAX® 2.00 mm High-Speed Backplane Vertical Header is designed for high-performance applications requiring reliable signal integrity and robust connectivity. This vertical header is ideal for backplane applications, providing a compact solution that supports high-speed data transmission. With its advanced design, it ensures optimal performance in demanding environments, making it a preferred choice for various electronic systems.

The ExaMAX® 2.00 mm High-Speed Backplane Vertical Header is designed for high-performance data communication in backplane applications. It is commonly used in data centers, telecommunications, and network switches due to its ability to support high-speed signals and ensure reliable connections. Engineers and designers rely on this connector for its robust construction and superior performance in demanding environments.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090
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