Description
200 Position 0.6 mm Memory Card Gold Flash Contact Plating SODIMM Socket
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  • 200 Positions for Enhanced Memory Capacity
  • Gold Flash Contact Plating for Superior Conductivity
  • Operating Temperature Range: -67°C to 85°C
  • Surface Mount Design for Space Efficiency
  • Lead-Free & RoHS Compliant

The TE Connectivity 200 Position 0.6 mm Memory Card SODIMM Socket is designed for high-performance memory applications, providing reliable connectivity for DDR SDRAM modules. This socket features a robust construction with gold flash contact plating and is suitable for surface mount technology. With a compact design and excellent thermal stability, it ensures optimal performance in various electronic devices.

The 200 Position SODIMM socket is designed for reliable connection in DDR and SDRAM memory applications, commonly used in laptops and compact devices. Its gold flash contact plating ensures superior conductivity and durability, making it ideal for high-performance memory modules. Engineers and manufacturers in electronics leverage this socket for its robust design and compliance with current environmental standards.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090
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