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- High Density with 440 Positions
- Robust Thermoplastic Housing
- Gold and Tin Contact Plating for Enhanced Conductivity
- Stackable Design for Space Efficiency
- Wide Operating Temperature Range: -40°C to 85°C
The TE Connectivity Fine Pitch Surface Mount Stacking Bd-to-Bd Connectors are designed for high-density applications requiring reliable signal connections. With a pitch of 19.7µm and a robust construction, these connectors support up to 440 positions across 4 rows. Their thermoplastic housing and gold-tin contact plating ensure durability and excellent conductivity, making them ideal for various electronic devices. The connectors are optimized for vertical PCB mounting and feature a stackable design, providing flexibility in space-constrained environments.
These board-to-board connectors facilitate reliable electrical connections between multiple printed circuit boards (PCBs) in compact electronic devices. With a fine pitch design and robust construction, they are commonly used in applications like telecommunications, automotive, and consumer electronics. Engineers and designers favor these connectors for their stackable feature and high current rating, ensuring efficient signal transmission in space-constrained environments.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.