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- High Density with 440 Positions
- Surface Mount Design for Easy Assembly
- Gold and Tin Contact Plating for Enhanced Conductivity
- Insulation Resistance of 2MΩ for Reliable Performance
- Operating Voltage Rating of 50V for Versatile Applications
The TE Connectivity Stacking Board-to-Board Connectors are designed for high-density applications requiring reliable signal connections. With a fine pitch of 500µm and a robust construction, these connectors support a variety of configurations and are ideal for surface mount applications. Featuring a vertical orientation and a stack height of 8mm, they ensure efficient space utilization on PCBs while maintaining excellent electrical performance.
The Stacking Board-to-Board Connectors are designed for high-density applications requiring efficient space-saving interconnect solutions. Commonly used in consumer electronics, industrial systems, and telecommunications, these connectors feature a fine pitch and a reliable surface mount design. They ensure secure connections with a current rating of 500mA, facilitating signal transmission in compact environments.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.