Description
Thrml Mgmt Access Heat Sink Clip Copper Alloy
Power Dissipation
5W
Datasheet
Product Image
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  • Width: 22mm
  • Height: 11.73mm
  • Power Dissipation: 5W
  • Power Rating: 15W
  • Lead-Free & RoHS Compliant

The TE Connectivity Thrml Mgmt Access Heat Sink Clip is designed to provide efficient thermal management for electronic components. Constructed from high-quality copper alloy, this clip ensures optimal heat dissipation, making it an essential component for maintaining performance in various applications. With its compact dimensions and robust design, it is suitable for a wide range of electronic devices requiring effective heat management.

The Thrml Mgmt Access Heat Sink Clip is designed to securely attach heat sinks to electronic components, enhancing thermal management in various applications. Commonly used in the electronics industry, it is ideal for devices requiring efficient heat dissipation, such as power amplifiers and processors. Engineers and technicians rely on this clip for its reliable performance and compatibility with lead-free and RoHS-compliant standards.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090
Quantity
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