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- 76 Circuits for High-Density Applications
- Right Angle Orientation for Space Efficiency
- Gold Plated Contacts for Enhanced Conductivity
- Operating Temperature Range: -40°C to 85°C
- Lead-Free & RoHS Compliant
The Molex QSFP-DD Surface Mount Connector is a high-density interconnect solution designed for advanced networking applications. With 76 circuits and a right-angle orientation, this connector ensures reliable performance in space-constrained environments. The gold plating on the contacts enhances conductivity and durability, making it suitable for high-speed data transmission. This connector operates efficiently across a wide temperature range, ensuring optimal performance in various conditions.
The QSFP-DD Surface Mount Connector is commonly used in high-density data and telecommunications applications, providing reliable connectivity for data centers and networking equipment. With 76 circuits and right-angle orientation, it supports high-speed signal transmission and is suitable for use in various electronic devices. Engineers and designers in the electronics industry utilize this connector for its durability and compliance with industry standards.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.