K4A8G165WC-BCWE

Description
DDR4 8Gb x 16 1.2V 3200MHz 0°C~85°C FBGA-96
Memory Technology
DDR4
Memory Type
SDRAM
Data Bus Width
16b
Memory Size
8Gb
Product Image
Quantity
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  • High Speed Operation at 3200MHz
  • Low Operating Voltage of 1.2V
  • Compact FBGA Package for Space-Saving Designs
  • Synchronous Memory Technology for Enhanced Performance
  • Wide Operating Temperature Range from 0°C to 85°C

The Samsung DDR4 8Gb x 16 memory module is designed to deliver exceptional performance and efficiency for modern computing applications. With a frequency of 3200MHz and a low operating voltage of 1.2V, this synchronous dynamic random-access memory (SDRAM) module is ideal for high-speed data processing. Housed in a compact FBGA package, it is suitable for surface mount applications and operates reliably within a temperature range of 0°C to 85°C, making it a versatile choice for various electronic devices.

The DRAM Chip DDR4 SDRAM 8Gb is designed for high-performance computing applications, providing reliable memory storage and fast data access. It features a density of 8Gb, a synchronous memory type, and operates at a frequency of 3200MHz, making it suitable for modern computing needs. The chip is encased in a 96-pin FBGA package and operates at a low voltage of 1.2V, ensuring energy efficiency in various devices such as laptops, desktops, and servers.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090
Quantity
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