K4UBE3D4AB-MGCL
- Description
- 32GB 8GX32 1.1V, 1.8V 4.266GHZ 32 Bit FBGA-200
- Memory Technology
- LPDDR4X
- Memory Type
- SDRAM
- Data Bus Width
- 32b
- Memory Size
- 32Gb
Quantity
16,000 AvailableLet us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
- 256Gb (32GB) density LPDDR4X SDRAM
- 200-ball FBGA surface-mount package
- Up to 4266M Hz operating frequency
- 32-bit data bus width
- 1.8V operating supply voltage
- -25°C to 85°C operating temperature range
The Samsung K4UBE3D4AB-MGCL is a 256Gb (32GB) LPDDR4X SDRAM memory device in a 200-ball FBGA package. It operates at up to 4266M Hz on a 1.8V supply across a 32-bit data bus. Rated for a -25°C to 85°C operating temperature range, this surface-mount, synchronous DRAM is currently in production.
LPDDR4X (Low-Power DDR4X) SDRAM is designed for power-sensitive, space-constrained systems. With its 4266M Hz speed and -25°C to 85°C range, the K4UBE3D4AB-MGCL is well suited to smartphones, tablets, automotive infotainment, and embedded or edge-compute platforms where high bandwidth and low power draw both matter. It is typically specified by mobile and embedded device engineers.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Quantity
16,000 AvailableLet us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.