K4ZAF325BC-SC20

Description
GDDR6 16Gb x 32 1.35V 20GHz 0°C~85°C FBGA-180
Memory Technology
GDDR6
Memory Type
SDRAM
Data Bus Width
32b
Memory Size
16Gb
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  • Synchronous GDDR6 Memory Technology
  • High Density of 16Gb
  • Data Bus Width of 32b
  • Operating Supply Voltage of 1.35V
  • Frequency of 20GHz
  • Temperature Range from 0°C to 85°C

The Samsung GDDR6 16Gb x 32 is a state-of-the-art memory module designed for high-performance applications requiring rapid data processing and efficient power consumption. This synchronous SDRAM memory technology operates at a frequency of 20GHz, making it ideal for graphics-intensive tasks and advanced computing environments. With a compact FBGA-180 package, it ensures optimal space utilization while delivering exceptional performance across a wide temperature range from 0°C to 85°C.

The DRAM Chip DDR6 SDRAM 16Gb 512Mx32 180-Pin FBGA is used for high-performance memory applications, providing synchronous access to data with a density of 16Gb. It is ideal for use in gaming graphics, data-intensive processing, and advanced computing systems, operating efficiently within a voltage range of 1.35V and supporting frequencies up to 20GHz. Its robust design of 180 pins in a compact FBGA package makes it a perfect choice for modern electronic devices requiring fast and reliable memory solutions.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090

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