K4ZAF325BM-HC14

Description
GDDR6 16Gb x 32 1.35V 0°C~95°C FBGA-180
Memory Technology
GDDR6
Memory Type
SDRAM
Data Bus Width
32b
Memory Size
16Gb
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Quantity
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  • High Performance GDDR6 Memory Technology
  • Large Memory Size of 16Gb
  • Synchronous Operation for Enhanced Speed
  • Operating Voltage of 1.35V
  • Wide Operating Temperature Range from 0°C to 95°C
  • Compact FBGA-180 Package with 180 Pins

The Samsung GDDR6 16Gb x 32 memory module is a cutting-edge synchronous dynamic random-access memory designed for high-performance applications. With a robust memory size of 16Gb and a data bus width of 32 bits, this module delivers exceptional speed and efficiency. Operating at a supply voltage of 1.35V, it is optimized for modern graphics and computing needs, ensuring reliable performance across a wide temperature range from 0°C to 95°C. Packaged in a compact FBGA-180 format, it is ideal for integration into advanced electronic systems.

The GDDR6 16Gb x 32 memory module is primarily used in high-performance graphics cards for gaming and professional applications. Its synchronous operation and advanced memory technology enable faster data transfer rates, making it ideal for rendering graphics and running demanding applications. Common users include gamers, graphic designers, and professionals in fields requiring intensive computing power.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090
Quantity
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