QCA-9377-3-115WLNSP-TR-03-0

Description
WLAN+BTCombo Module Chip IEEE 802.11a/b/g/n/ac Bluetooth v4.2 + HS Class I/Class II 115-Pin WLNSP
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  • Supports IEEE 802.11a/b/g/n/ac Standards
  • Bluetooth v4.2 + HS Class I/Class II Compatibility
  • Compact 115-Pin WLNSP Package
  • High Performance for Wireless Applications

The Qualcomm WLAN+BTCombo Module Chip is a versatile and high-performance solution designed for seamless wireless connectivity. Supporting IEEE 802.11a/b/g/n/ac standards and Bluetooth v4.2, this module is ideal for a wide range of applications requiring reliable and fast wireless communication. With its compact 115-pin WLNSP package, it is engineered to fit into various designs while delivering exceptional performance in both WLAN and Bluetooth functionalities.

The WLAN+BTCombo Module Chip is designed for integrating both Wi-Fi and Bluetooth capabilities into a single device, supporting IEEE standards for a seamless wireless experience. It is commonly used in consumer electronics, smart home devices, and IoT applications to enable wireless connectivity. Key users include manufacturers of smartphones, tablets, and other portable devices looking for high-performance wireless solutions.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090
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