QCA-9377-3-115WLNSP-TR-03-0

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- Supports IEEE 802.11a/b/g/n/ac Standards
- Bluetooth v4.2 + HS Class I/Class II Compatibility
- Compact 115-Pin WLNSP Package
- High Performance for Wireless Applications
The Qualcomm WLAN+BTCombo Module Chip is a versatile and high-performance solution designed for seamless wireless connectivity. Supporting IEEE 802.11a/b/g/n/ac standards and Bluetooth v4.2, this module is ideal for a wide range of applications requiring reliable and fast wireless communication. With its compact 115-pin WLNSP package, it is engineered to fit into various designs while delivering exceptional performance in both WLAN and Bluetooth functionalities.
The WLAN+BTCombo Module Chip is designed for integrating both Wi-Fi and Bluetooth capabilities into a single device, supporting IEEE standards for a seamless wireless experience. It is commonly used in consumer electronics, smart home devices, and IoT applications to enable wireless connectivity. Key users include manufacturers of smartphones, tablets, and other portable devices looking for high-performance wireless solutions.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.