PMP-8074-0-112MSP-MT-00-0-01
- 112-Pin FBGA Package for Space Efficiency
- Optimized Power Management for Mobile Devices
- High Performance with Low Power Consumption
- Seamless Integration into Modern Circuit Designs
The Qualcomm Power Management IC in a 112-Pin FBGA package is designed to optimize power efficiency and performance in a variety of electronic applications. This advanced component is ideal for mobile devices and other power-sensitive applications, ensuring reliable operation while minimizing energy consumption. With its compact form factor, it seamlessly integrates into modern circuit designs, providing essential power management capabilities.
The Power Management IC 112-Pin FBGA is designed for efficiently managing power in electronic devices, providing reliable performance with a compact footprint. Its 112-pin configuration allows for extensive connectivity options, making it suitable for various applications in modern electronics, especially in mobile devices and computing systems.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.