K4ZAF325BC-SC16
- Description
- GDDR6 16Gb x 32 1.35V 8GHz 0°C~95°C FBGA-180
- Memory Technology
- GDDR6
- Memory Type
- SDRAM
- Data Bus Width
- 32b
- Memory Size
- 16Gb
Quantity
5,600 AvailableLet us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
- High-Speed Data Transfer at 8GHz
- 16Gb Memory Size for Enhanced Performance
- Operating Supply Voltage of 1.35V
- Wide Operating Temperature Range: 0°C to 95°C
- Synchronous SDRAM Technology for Improved Efficiency
- Compact FBGA-180 Package with 180 Pins
The Samsung GDDR6 16Gb x 32 memory module is designed for high-performance graphics applications, delivering exceptional speed and efficiency. With a robust operating frequency of 8GHz and a synchronous data transfer mechanism, this memory module is ideal for gaming, AI, and machine learning tasks. Its compact FBGA-180 package ensures easy integration into various systems while maintaining optimal thermal performance across a wide temperature range.
The DRAM Chip DDR6 DRAM 16Gb 512Mx32 180-Pin FBGA is used for high-performance computing applications that require advanced memory capabilities, such as graphics processing, gaming, and data-intensive tasks. With its synchronous operation, this GDDR6 memory chip offers a substantial capacity of 16Gb and a fast data transfer frequency of 8GHz, making it ideal for modern devices that demand efficient and reliable memory solutions. Its design includes a compact FBGA package, facilitating easy integration into various electronic devices while operating within a voltage range of 1.35V and temperature conditions from 0°C to 95°C.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Quantity
5,600 AvailableLet us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.