KLMDG2RCTE-B041

Description
FLASH/eMMC 5.1 HS400 1.8V/3.3V 128GB 153-Pin FBGA
Density
128Gb
Interface
eMMC 5.1
Samsung KLMDG2RCTE-B041 product image

Quantity

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  • High Capacity: 128Gb Density
  • Fast Interface: eMMC 5.1
  • Compact Package: 153-Pin FBGA
  • Versatile Voltage Support: 1.8V and 3.3V

The Samsung FLASH/eMMC 5.1 HS400 is a high-capacity storage solution designed for modern electronic devices requiring fast and reliable memory performance. With a density of 128Gb, this eMMC memory module is optimized for efficient data transfer and storage, making it ideal for smartphones, tablets, and other portable devices. Housed in a compact 153-Pin FBGA package, it ensures a space-saving design without compromising on performance.

The Samsung FLASH/eMMC 5.1 HS400 is commonly used for high-performance data storage in mobile devices, tablets, and embedded applications. With a 128GB capacity and a 153-Pin FBGA package, it provides efficient read and write speeds, making it ideal for applications requiring fast access to data. This product is typically utilized by manufacturers seeking reliable and compact flash memory solutions.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090

Quantity

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