NRF52805-CAAA-R
Description
Bluetooth 5.2 SoC in a WLCSP optimized for small two-Layer PCB designs
Quantity
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Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
Fusion-Tested. Quality Guaranteed.
- Bluetooth 5.2 Technology for Enhanced Connectivity
- Optimized WLCSP Package for Space Efficiency
- Low Power Consumption for Extended Battery Life
- High Data Throughput for Fast Data Transfer
The Nordic Semiconductor Bluetooth 5.2 SoC in a WLCSP package is designed for small two-layer PCB applications, offering advanced connectivity solutions for a variety of devices. This system-on-chip integrates Bluetooth 5.2 technology, ensuring efficient power consumption and enhanced data throughput. Its compact form factor makes it ideal for space-constrained designs while maintaining high performance and reliability in wireless communication.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
AS6081
AS9120B
ISO 9001
QMS STD 9090
Quantity
Need this part?
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
Fusion-Tested. Quality Guaranteed.
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