573300D00000G
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- Efficient Thermal Resistance of 16C/W
- Designed for D2Pak and TO263 Packages
- Horizontal Orientation for Space Optimization
- Compact Size of 26.16mm
- Lead-Free & RoHS Compliant
The Boyd Stamped Heat Sink is designed for efficient thermal management in electronic applications utilizing D2Pak and TO263 packages. With a thermal resistance of 16C/W, this horizontal heat sink ensures optimal heat dissipation, enhancing the reliability and performance of your devices. Its robust construction and compact dimensions of 26.16mm make it an ideal choice for bulk applications where space and efficiency are critical.
The Heat Sinks Stamped Heat Sink is designed for efficient thermal management in electronic devices using D2Pak/TO263 packages. With a thermal resistance of 16C/W, it dissipates heat effectively to maintain optimal performance and reliability. Commonly used by engineers and manufacturers in the electronics industry, it’s ideal for applications where space is limited but heat dissipation is critical.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.