SEAM-40-06.5-S-10-2-A-K-TR
- Description
- High-Speed High-Density Open-Pin-Field Array Terminal
- Datasheet
Quantity
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- Gold Contact Plating for enhanced conductivity
- Low Contact Resistance of 5.5mO for improved signal integrity
- Compact Depth of 14.68mm for space-saving designs
- High Number of Contacts: 400 for versatile applications
- Temperature Range: -55°C to 125°C for extreme conditions
- Lead-Free & RoHS Compliant
The Samtec High-Speed High-Density Open-Pin-Field Array Terminal is designed for high-performance applications requiring reliable connectivity and efficient space utilization. With a robust male configuration and a compact design, this terminal is ideal for various electronic systems. Its advanced features ensure optimal performance in demanding environments, making it a preferred choice for engineers and designers.
The High-Speed High-Density Open-Pin-Field Array Terminal is designed for high-performance electronic connections, commonly utilized in telecommunications, aerospace, and data communication applications. It features a high contact density with 400 contacts in a compact design, making it ideal for space-constrained environments. Engineers and designers benefit from its reliability in maintaining low contact resistance and high-temperature performance.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Quantity
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.