125800D00000G

Description
Heat Sink Solder Anchor, BGA Packages, 2.49 mm
Mount
Clip
Datasheet
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  • Designed for BGA Packages
  • Compact Dimensions: 2.49 mm Depth, 7.62 mm Length
  • Lead-Free and RoHS Compliant
  • Secure Clip Mounting for Easy Installation
  • Passive Component for Effective Heat Dissipation

The Aavid Thermalloy Heat Sink Solder Anchor is a premium thermal management solution designed specifically for BGA packages. With a compact depth of 2.49 mm and a height of 7.19 mm, this passive component effectively dissipates heat, ensuring optimal performance and reliability in electronic applications. Engineered to be lead-free and compliant with RoHS standards, it meets the stringent requirements of modern electronics while providing a secure mount via clip installation. This heat sink solder anchor is an essential component for enhancing thermal efficiency in various electronic devices.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090
Quantity
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