K4F6E3S4HB-MGCL
- Description
- LPDDR4 16Gb x 32 1.1V 4266MHz -25°C~85°C FBGA-200
- Memory Technology
- LPDDR4
- Memory Type
- SDRAM
- Data Bus Width
- 32b
- Memory Size
- 16Gb
- Access Time
- 3.5ns
Quantity
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
- 16Gb Density with a 32-Bit Data Bus
- LPDDR4 Memory technology, Synchronous Operation
- 4266M Hz Specified frequency, 3.5ns Access Time
- 200-Ball FBGA Surface-Mount Package
- Dual-Rail Supply: 1.06V to 1.17V Core and 1.7V to 1.95V
- 1.1V Nominal Core Voltage
- -25C to 85C Operating Temperature Range
The K4F6E3S4HB-MGCL is a Samsung LPDDR4 SDRAM of 16Gb density with a 32-bit data bus, supplied in a 200-ball FBGA package. It is specified at 4266M Hz with a 3.5ns access time and operates from dual rails, 1.06V to 1.17V and 1.7V to 1.95V, at a nominal 1.1V core. The device is rated across a -25C to 85C operating range and operates synchronously.
LPDDR4 at 4266M Hz is the working memory placed directly beside an application processor or SoC in systems where board area and power budget rule out a socketed module. A 16Gb x32 device such as the K4F6E3S4HB-MGCL is commonly specified for automotive infotainment and driver-assistance modules, network edge and 5G equipment, industrial single-board computers and gateways, smart displays, and set-top and streaming platforms. The -25C to 85C rating fits enclosed and in-cabin placements rather than open outdoor mounting. Buyers are OEM platform engineering teams and the ODMs and contract manufacturers building the modules.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Quantity
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.