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- High Data Rate of 8Gbps
- Compact FCBGA Package Dimensions: 13mm x 20mm x 2.84mm
- Lead-Free & RoHS Compliant
- Surface Mount Design for Easy Integration
- 345 Pins for Enhanced Connectivity
- Lead-Free & RoHS Compliant
The Renesas FCBGA is a high-performance electronic component designed for advanced applications requiring efficient data transfer and reliable connectivity. With a compact footprint and robust construction, this FCBGA package is ideal for surface mount technology, ensuring seamless integration into various electronic systems. It supports high data rates and operates effectively within a specified temperature range, making it suitable for diverse industrial applications.
The FCBGA 13.00x20.00x2.84 mm 0.80mm Pitch is commonly used in high-speed data applications requiring reliable signal integrity. Key capabilities include supporting a data rate of 8Gbps and optimal performance in surface mount configurations. It is primarily utilized by engineers and designers in the telecommunications and computer hardware industries, especially for applications needing compact, lead-free packaging solutions.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.