K4AAG165WC-BIWE

Description
DDR4 16Gb x 16 1.2V 3200MHz -40°C~95°C FBGA-96
Memory Technology
DDR4
Memory Type
SDRAM
Data Bus Width
16b
Memory Size
16Gb
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  • High Density 16Gb Memory Capacity
  • Fast Data Transfer Rate of 3200MHz
  • Low Operating Voltage of 1.2V
  • Wide Operating Temperature Range from -40°C to 95°C
  • Synchronous SDRAM Technology
  • 96 Pin FBGA Package for Surface Mount Applications

The Samsung DDR4 16Gb x 16 memory module is designed to deliver exceptional performance and efficiency for modern computing applications. With a frequency of 3200MHz and a low operating voltage of 1.2V, this memory module ensures high-speed data processing while minimizing power consumption. Its robust design supports a wide operating temperature range from -40°C to 95°C, making it suitable for various environments. The FBGA-96 package allows for efficient surface mounting, ensuring reliable integration into your systems.

The DDR4 16Gb x 16 RAM is designed for high-performance computing applications, providing efficient memory solutions for servers and workstations. With a frequency of 3200MHz and a wide temperature range, it is suitable for demanding environments. This memory module is commonly used by manufacturers and developers looking for reliable memory in advanced computing systems.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090

Quantity

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