HSB03-141406
- Description
- Heat Sink Passive BGA Vertical SMD Aluminum 6063-T5 15.8C/W Black Anodized
- Datasheet
Quantity
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- Efficient Thermal Management with 15.8C/W Resistance
- Durable Aluminum 6063-T5 Construction
- Sleek Black Anodized Finish
- Compact Length of 14mm for Space-Constrained Designs
The CUI Inc Heat Sink is a high-efficiency passive thermal management solution designed for BGA vertical SMD applications. Constructed from durable aluminum 6063-T5 and finished with a sleek black anodized coating, this heat sink effectively dissipates heat to ensure optimal performance and reliability in electronic devices. With a thermal resistance of 15.8C/W, it is ideal for maintaining safe operating temperatures in compact spaces.
This heat sink is designed to dissipate heat from BGA devices in compact electronic assemblies, ensuring optimal performance and longevity. Made from aluminum with a durable black anodized finish, it offers excellent thermal conductivity at a rating of 15.8C/W. Commonly used by engineers and manufacturers in the electronics industry, it is ideal for applications requiring efficient thermal management in space-constrained environments.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Quantity
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.