ATB2012-50011-T000
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- Impedance of 50Ω for optimal signal integrity
- Compact 2012 case size for space-saving designs
- Max operating temperature of 85°C for reliable performance
- Surface mount design for easy integration
- Lead-Free & RoHS Compliant
The TDK ATB Series 2012 is a high-performance SMD wound chip balun designed for applications requiring precise impedance matching and efficient signal transmission. With a compact 2012 case size, this balun is ideal for space-constrained designs while delivering reliable performance in various electronic devices. It operates effectively within a wide temperature range, making it suitable for diverse environments and applications.
The ATB Series 2012 Chip Balun is designed for RF applications requiring efficient impedance transformation and signal integrity in compact designs. Commonly used in communications, IoT devices, and antenna applications, it features a surface mount design ideal for automated assembly. Engineers and designers utilize this component to enhance performance in low-profile wireless circuits.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.