H5AG48DXNDX116N

Description
DDR3 512MB x 16 1.5V 1600MHz -40°C~85°C BGA-96
Memory Technology
DDR3
Memory Type
DRAM
Data Bus Width
16b
Memory Size
512MB
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  • High Density 4Gb Memory Technology
  • Fast Data Transfer Rate of 1600MHz
  • Wide Operating Temperature Range from -40°C to 85°C
  • Low Operating Voltage of 1.5V
  • 96 Pin BGA Package for Surface Mount Applications

The SK Hynix DDR3 512MB x 16 memory module is designed for high-performance computing applications requiring efficient data processing and reliability. With a compact BGA package, this DRAM module operates at a frequency of 1600MHz and is optimized for a wide temperature range from -40°C to 85°C. This memory solution is ideal for various electronic devices, ensuring stable performance in demanding environments.

The DDR3 512MB x 16 RAM module is commonly used in various electronic devices that require reliable and efficient memory performance, such as laptops, servers, and embedded systems. With a frequency of 1600MHz and a wide operating temperature range from -40°C to 85°C, it is suitable for industrial applications. This memory is ideal for systems that demand high-speed data access and resilience under extreme conditions.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090

Quantity

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