H5AG48DXNDX116N
- Description
- DDR3 512MB x 16 1.5V 1600MHz -40°C~85°C BGA-96
- Memory Technology
- DDR3
- Memory Type
- DRAM
- Data Bus Width
- 16b
- Memory Size
- 512MB
Quantity
12,800 Available- Lead time to Ship
- 14 Days
- Shipping Cost
- Free $0.00
Packaging & Pricing
| Quantity | Unit Price |
|---|---|
| 1600+ | |
Shipping Details
- Ships From
- SINGAPORE
- Country of Origin
- -
- Lead Time to Ship
- -
- Date Code
- -
- High Density 4Gb Memory Technology
- Fast Data Transfer Rate of 1600MHz
- Wide Operating Temperature Range from -40°C to 85°C
- Low Operating Voltage of 1.5V
- 96 Pin BGA Package for Surface Mount Applications
The SK Hynix DDR3 512MB x 16 memory module is designed for high-performance computing applications requiring efficient data processing and reliability. With a compact BGA package, this DRAM module operates at a frequency of 1600MHz and is optimized for a wide temperature range from -40°C to 85°C. This memory solution is ideal for various electronic devices, ensuring stable performance in demanding environments.
The DDR3 512MB x 16 RAM module is commonly used in various electronic devices that require reliable and efficient memory performance, such as laptops, servers, and embedded systems. With a frequency of 1600MHz and a wide operating temperature range from -40°C to 85°C, it is suitable for industrial applications. This memory is ideal for systems that demand high-speed data access and resilience under extreme conditions.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
Quantity
12,800 Available- Lead time to Ship
- 14 Days
- Shipping Cost
- Free $0.00
Packaging & Pricing
| Quantity | Unit Price |
|---|---|
| 1600+ | |
Shipping Details
- Ships From
- SINGAPORE
- Country of Origin
- -
- Lead Time to Ship
- 14 Days
- Date Code
- 25+