IS22EF08G-JCLA2

Description
Flash Memory, MLC NAND, 8 Gbyte, 64G x 1bit, 16G x 4bit, 8G x 8bit, eMMC 5.1, 153 Pins, FBGA
Interface
Serial
Datasheet
ISSI IS22EF08G-JCLA2 product image

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  • Managed MLC NAND with an Integrated eMMC 5.1 Controller
  • 8 Gigabyte capacity, 64 Gigabit Density
  • 2.7V to 3.6V Supply at 3.3V nominal, 45 mA Maximum Supply Current
  • Interface Clock Up to 200 Megahertz
  • 153-Ball FBGA, 13mm by 11.5mm, 500um Ball Pitch
  • Extended -40C to 105C Operating Range

The ISSI IS22EF08G-JCLA2 is an 8 GByte (64 Gbit) MLC NAND flash device with an integrated eMMC 5.1 controller, supplied in a 153-ball FBGA measuring 13mm by 11.5mm with a 1mm maximum seated height at 500um ball pitch. eMMC is managed NAND: the controller, wear levelling, bad-block management and error correction all sit inside the package, so the host sees a simple block storage device. It operates from a 2.7V to 3.6V supply at 3.3V nominal, at up to 200 MHz with 45 mA maximum supply current, across an extended -40C to 105C range. Two record notes: this part is filed under the NAND category while the sibling IS21EF08G-JCLI-TR record sits under eMMC, and the Interface field reads only 'Serial' with the eMMC 5.1 revision appearing solely in the product title; REACH SVHC is also flagged Yes.

An 8GB eMMC is the mainstream capacity for embedded systems running a full Linux or Android image with room for application data, logs and over-the-air update staging: industrial HMI panels and gateways, digital signage players, networking equipment, point-of-sale terminals, medical instruments, and automotive head units and telematics boxes. The 105C upper operating limit is what separates this part from a commercial-grade device, and it is a requirement for high-ambient cabinet, engine-bay-adjacent and sealed-enclosure installations. MLC rather than TLC flash is specified where write endurance across a long service life would be marginal on a three-bit-per-cell part, which is common in logging and industrial duty. Designers choose eMMC over raw NAND to avoid owning a flash translation layer, and over a small SSD because it solders down at a fraction of the cost and board area.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090

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