W664GG6RB-06
- Description
- IC Dram 4GBIT POD_12 96VFBGA
Quantity
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- 4Gbit (4Gb) DRAM density
- 96-ball VFBGA package
- Surface-mount BGA form factor
- Winbond DRAM component
The Winbond W664GG6RB-06 is a 4Gbit DRAM component supplied in a 96-ball VFBGA package. It provides 4Gb of memory density in a surface-mount BGA form factor for embedded and computing designs. The device is a Winbond-branded DRAM part.
This DRAM component is used as working memory in embedded systems, consumer electronics, and networking equipment. The compact VFBGA package suits space-constrained board designs. It provides volatile system memory for processors and controllers that require external DRAM.
Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.
AS6081
AS9120B
ISO 9001
QMS STD 9090
Quantity
Need this part?
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
Let us do the sourcing. Even if it's not available now, our team can track it down and tailor a solution just for you.
Fusion-Tested. Quality Guaranteed.
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