H58G78CK8BX185N

• SK Hynix LPDDR5X Synchronous SDRAM, 16Gb (2GB) Density
• 16-Bit Data Bus width, 4266M Hz Rated Frequency
• 1.05V Operating supply; 1.01V-1.12V and 1.7V-1.95V Rail Ranges
• 315-Ball FBGA, Surface-Mount
• -25C to +85C Commercial Operating Temperature Range
• LPDDR5X Extends the LPDDR5 Standard to Higher Data Rates at the Same Low Core Voltage

The H58G78CK8BX185N is an SK Hynix LPDDR5X mobile SDRAM supplied in a 315-ball FBGA surface-mount package. It provides 16Gb of density, equivalent to 2GB, on a 16-bit data bus at a rated 4266M Hz. The device operates from a 1.05V supply with rail ranges of 1.01V-1.12V and 1.7V-1.95V. SK Hynix specifies the H58G78CK8BX185N over a -25C to +85C operating temperature range.

LPDDR5X is the highest-bandwidth low-power DRAM tier in volume production and is specified where the memory interface, not the compute core, limits performance. A x16 device such as the H58G78CK8BX185N is placed in multiples to assemble a wide memory bus, which is the standard arrangement in flagship smartphone and tablet processors, on-device AI accelerators, automotive central compute platforms, AR and XR headsets, and high-throughput networking silicon. The 315-ball FBGA footprint is the current LPDDR5 and LPDDR5X package standard, so it aligns with recent SoC reference designs. Buyers are typically OEM platform teams and module assemblers building multi-die memory subsystems.