H58G56CK8BX146

• SK Hynix LPDDR5X Synchronous SDRAM, 32Gb (4GB) Density
• 16-Bit Data Bus width, 3750M Hz Rated Frequency
• 1.05V Operating supply; 1.01V-1.12V and 1.7V-1.95V Rail Ranges
• 315-Ball FBGA, Surface-Mount
• -25C to +85C Commercial Operating Temperature Range
• LPDDR5X Extends LPDDR5 Data Rates at the Same Low Core Voltage

The H58G56CK8BX146 is an SK Hynix LPDDR5X mobile SDRAM supplied in a 315-ball FBGA surface-mount package. It provides 32Gb of density, equivalent to 4GB, on a 16-bit data bus at a rated 3750M Hz. The device operates from a 1.05V supply with rail ranges of 1.01V-1.12V and 1.7V-1.95V. SK Hynix specifies the H58G56CK8BX146 across a -25C to +85C operating temperature range.

LPDDR5X devices on a 16-bit bus are normally placed in multiples so a platform can build a 32-bit or 64-bit memory interface from small, easily routed packages. That topology is standard in smartphone and tablet application processors, on-device AI inference engines, automotive cockpit and compute platforms, AR and XR headsets, and high-bandwidth networking silicon. At 4GB per device, the H58G56CK8BX146 lets designers scale total capacity by populating additional sites rather than moving to a larger die. The 315-ball FBGA is the current LPDDR5 and LPDDR5X package standard. Buyers are OEM platform teams and module assemblers integrating memory directly beside an SoC.