FLXC2002G-N2

Description
LPDDR4X SDRAM 512M x 32 -25°C ~ 85°C 0.6V FBGA-200
Memory Technology
LPDDR4X
Memory Type
SDRAM
FORESEE FLXC2002G-N2 product image

Quantity

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  • 16Gb LPDDR4X SDRAM Density
  • 512M X 32 organization, 32-Bit Wide Device Bus
  • 1866M Hz Operating Frequency
  • 0.6V I/O voltage; Supply Ranges Recorded as 1.06V to 1.17V and 1.7V to 1.95V
  • 200-Ball FBGA Surface-Mount Package
  • -25degC to 85degC Operating Temperature Range
  • Obsolete Lifecycle Status

The FORESEE FLXC2002G-N2 is a 16Gb LPDDR4X SDRAM organized as 512M x 32, supplied in a 200-ball FBGA package. The x32 organization means a single device presents a 32-bit wide bus, so one or two packages can serve a complete memory interface without the device count a x8 or x16 part would need. The record lists a 0.6V I/O voltage with supply ranges of 1.06V to 1.17V and 1.7V to 1.95V, which reflects the separate core and I/O rails LPDDR4X uses. Operating frequency is 1866M Hz and the temperature range is -25°C to 85°C. This part is marked obsolete.

The FLXC2002G-N2 is used as system memory in power-sensitive embedded designs where LPDDR4X replaces DDR to cut interface power. The x32 organization suits application processors and So Cs with a 32-bit or 64-bit LPDDR controller, so parts of this class appear in tablets, smart displays and set-top boxes, automotive infotainment and telematics units, industrial HMI panels and gateways, network edge devices, and single-board computers and compute modules. Because the part is marked obsolete, buyers are typically sustaining an existing platform where the memory layout and timing are already qualified and substituting a different device would require board and firmware revalidation. That makes remaining open-market stock of this exact part number the practical sourcing route.

Fusion’s in-house quality hubs and Prosemi testing facility are fully certified to meet critical industry standards for electronic component inspection and testing.

AS6081
AS9120B
ISO 9001
QMS STD 9090

Quantity

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